LOCTITE® ABLESTIK ATB F125E
Features and Benefits
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.
LOCTITE® ABLESTIK ATB F125E is a white, high-reliability epoxy adhesive film with a thickness of 25μm. It is typically used for die attach in discrete, IC, and chip stack packages. It’s ideal for wafer lamination processes or as a preform decal, where it shows excellent workability and provides consistent dicing and die pickup for small die applications.
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Technical Information
| Adhesive film thickness | 25.0 µm |
| Application method | Lamination |
| Applications | Die attach |
| Carrier type | Polyolefin |
| Colour | White |
| Cure type | Heat cure, UV cure |
| Dicing tape diameter | 12.0 |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 2.0 ppm |
| Hot die shear strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate | 3.1 kg-f |
| Key characteristics | Work life: long work life |
| Moisture absorption | 0.78 % |
| Physical form | Film |
| Recommended for use with | Laminate |
| Tensile modulus, @ 250.0 °C | 185.0 N/mm² (26831.0 psi ) |
| Wafer diameter | 12.0 |
| Weight loss, TGA @ 200.0 °C | 0.27 % |
LOCTITE® ABLESTIK ATB F125E
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.