LOCTITE® ABLESTIK ATB F125E
功能与优点
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.
LOCTITE® ABLESTIK ATB F125E is a white, high-reliability epoxy adhesive film with a thickness of 25μm. It is typically used for die attach in discrete, IC, and chip stack packages. It’s ideal for wafer lamination processes or as a preform decal, where it shows excellent workability and provides consistent dicing and die pickup for small die applications.
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技术信息
| 主要特性 | 适用时间：长 |
| 切割蓝膜直径 | 12.0 |
| 可萃取出的离子含量, 氯化物 (CI-) | 19.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 2.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 1.0 ppm |
| 吸湿性 | 0.78 % |
| 固化方式 | 热+紫外线, 紫外线固化 |
| 外观形态 | 电影 |
| 应用 | 芯片焊接 |
| 应用方法 | 层压 |
| 拉伸模量, @ 250.0 °C | 185.0 N/mm² (26831.0 psi ) |
| 推荐与以下物料搭配使用 | 层压材料 |
| 晶圆直径 | 12.0 |
| 热模剪切强度, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate | 3.1 kg-f |
| 粘合剂膜厚度 | 25.0 µm |
| 载体类型 | 聚烯烃 |
| 重量损失, TGA @ 200.0 °C | 0.27 % |
| 颜色 | 白 |
LOCTITE® ABLESTIK ATB F125E
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.