LOCTITE® ABLESTIK ATB F125E
Features and Benefits
LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.
LOCTITE® ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.
- Excellent workability
- Ideal modulus for wide range of package sizes
- Meets thin wafer requirements
- High reliability
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Adhesive film thickness | 25.0 µm |
| Application method | Lamination |
| Applications | Die attach |
| Carrier type | Polyolefin |
| Color | White |
| Cure type | Heat cure, UV cure |
| Dicing tape diameter | 12.0 |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 2.0 ppm |
| Hot die shear strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate | 3.1 kg-f |
| Key characteristics | Work life: long work life |
| Moisture absorption | 0.78 % |
| Physical form | Film |
| Recommended for use with | Laminate |
| Tensile modulus, @ 250.0 °C | 185.0 N/mm² (26831.0 psi ) |
| Wafer diameter | 12.0 |
| Weight loss, TGA @ 200.0 °C | 0.27 % |
LOCTITE® ABLESTIK ATB F125E
LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.