LOCTITE® ABLESTIK ATB F125E
功能與優點
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.
LOCTITE® ABLESTIK ATB F125E is a white, high-reliability epoxy adhesive film with a thickness of 25μm. It is typically used for die attach in discrete, IC, and chip stack packages. It’s ideal for wafer lamination processes or as a preform decal, where it shows excellent workability and provides consistent dicing and die pickup for small die applications.
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技術資訊
| 使用方法 | 層壓 |
| 切割藍膜直徑 | 12.0 |
| 可萃取出的離子含量, 氯化物(CI-) | 19.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 2.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 1.0 ppm |
| 吸濕性 | 0.78 % |
| 固化類型 | 熱固化, 紫外固化 |
| 建議推廣應用 | 層壓 |
| 應用 | 晶片焊接 |
| 拉伸模量, @ 250.0 °C | 185.0 N/mm² (26831.0 psi ) |
| 晶圓直徑 | 12.0 |
| 熱模剪切強度, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate | 3.1 kg-f |
| 物理形態 | 薄膜 |
| 載體類型 | 聚烯烴 |
| 重量損失, TGA @ 200.0 °C | 0.27 % |
| 關鍵特性 | 使用期限：較長使用期限 |
| 顏色 | 白色 |
| 黏合劑膜厚度 | 25.0 µm |
LOCTITE® ABLESTIK ATB F125E
This white, highly reliable, epoxy-based adhesive film can be used for die-attach applications.