LOCTITE® ECCOBOND E 3230
Features and Benefits
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant
LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
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Technical Information
| Casson viscosity, @ 25.0 °C Shear Rate 10 s⁻¹ | 45200.0 mPa·s (cP) |
| Cure schedule, @ 100.0 °C | 20.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 58.0 °C |
| Storage temperature | -20.0 °C |
| Thixotropic index | 1.6 |
LOCTITE® ECCOBOND E 3230
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant