LOCTITE® ABLESTIK QMI505MT
Features and Benefits
LOCTITE ABLESTIK QMI505MT, Rubberized epoxy, Die attach
LOCTITE® ABLESTIK QMI505MT die attach paste is designed for attachment of integrated circuits and components to advanced metal and ceramic surfaces. A package or device manufactured with LOCTITE ABLESTIK QMI505MT will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. Please refer to the TDS for alternate cure schedules.
- Electrically conductive
- Hydrophobic
- Stable at high temperatures
- Void-free bondline
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 72.0 ppm/°C |
| Color | Silver |
| Cure type | Heat cure |
| Density, Maximum Final | 3.4 g/cm³ |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Fluoride (F-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 20.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Key characteristics | Adhesion: excellent adhesion, Conductivity: electrically conductive, Conductivity: thermally conductive, Cure speed: very fast, Dispensable, Dispensibility: good dispensibility, Filler: Ag filled, Modulus: low modulus, Pot life: long pot life, filler: silver filled |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 7.5 x 7.5 mm Si die on Ag plated Cu leadframe | 35.0 kg-f |
| Recommended for use with | Ceramic, LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, DMA @ 25.0 °C | 860.0 N/mm² |
| Thixotropic index | 4.8 |
LOCTITE® ABLESTIK QMI505MT
LOCTITE ABLESTIK QMI505MT, Rubberized epoxy, Die attach