Henkel's range of BMI-based adhesives enabled the proliferation of array type packaging when it was first introduced. Continuing this tradition, Henkel is facilitating advances in IC packaging with new material systems designed for high performance and reliability in small formats, such as LGA devices, all the way to very large format system-in-package and system-in-module technology. Whether paste, liquid or film, Henkel's materials are engineered for maximum efficiency and are developed in conjunction with leading-edge applications, giving semiconductor specialists the peace of mind to confidently integrate our materials for the most demanding processes and requirements.
Wirebond Laminate Packages
Henkel Solutions for Laminate Packages
Die Attach Pastes
A broad selection of electrically non-conductive and conductive LOCTITE ABLESTIK die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to SmartCards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.
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Resources for Wirebond Laminate Packaging
Brochure: Materials for Wirebond Packaging
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