BERGQUIST® SIL PAD® TSP 3500
被称为 Sil-Pad® 2000
功能与优点
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
- 热阻抗0.33°C-in2/W（@50psi）
- 高导热系数3.5 W/m-K
- 最佳导热性能
文件和下载
寻找另一种语言的TDS或SDS？
技术信息
| 导热性 | 3.5 W/mK |
| 操作温度 | -60.0 - 200.0 °C |
| 标准厚度 | 0.254 - 0.508 mm |
| 载体类型 | 玻璃纤维 |
| 阻燃性 | V-0 |
| 颜色 | 白 |
常见问题
BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500产品之间的主要区别是什么？
我应该在什么时候为我的应用选择BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500？
BERGQUIST® SIL PAD TSP A3000和BERGQUIST® SIL PAD TSP 3500之间的导电特性是否存在差异？
我如何知道哪种SIL PAD产品适合我的特定用途？
什么是IS09001:2008？
BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.