BERGQUIST® SIL PAD® TSP 3500
Znany jako Sil-Pad® 2000
Właściwości i korzyści
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximise both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fibreglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace and avionics.
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Informacje techniczne
| Grubość standardowa | 0.254 - 0.508 mm |
| Klasa palności | V-0 |
| Kolor | Biały |
| Przewodność cieplna | 3.5 W/mK |
| Temperatura robocza | -60.0 - 200.0 °C |
| Typ nośnika | Włókno szklane |
BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.