BERGQUIST® SIL PAD® TSP 3500
Poznat kao Sil-Pad® 2000
Elementi i pogodnosti
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximise both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fibreglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace and avionics.
Pročitajte više
Dokumenti i preuzimanja
Tražite tehničke listove ili bezbednosne listove na drugom jeziku?
Dodatna dokumenta
Tehnički podaci
| Boja | Bela |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.254 - 0.508 mm |
| Tip nosača | Staklena vuna |
| Toplotna provodljivost | 3.5 W/mK |
BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.