BERGQUIST® SIL PAD® TSP 3500
Connu sous le nom de Sil-Pad® 2000
Caractéristiques et avantages
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
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Informations techniques
| Conductivité thermique | 3.5 W/mK |
| Cote d'inflammabilité | V-0 |
| Couleur | Blanc |
| Température de service | -60.0 - 200.0 °C |
| Type porteur | Fibre de verre |
| Épaisseur standard | 0.254 - 0.508 mm |
BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.