BERGQUIST® SIL PAD® TSP 3500
Features and Benefits
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
- Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
- High thermal conductivity 3.5 W/m-K
- Optimal heat transfer
- Easy to use and rework
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | White |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.254 - 0.508 mm |
| Thermal conductivity | 3.5 W/mK |
BERGQUIST® SIL PAD® TSP 3500
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.