LOCTITE® ABLESTIK QMI546
Omadused ja eelised
LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
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Tehniline teave
| Klaasistumistemperatuur (Tg) | 10.0 °C |
| Rakendused | Stantskinnitus |
| Soojusjuhtivus | 0.2 W/mK |
| Soojuspaisumise koefitsient (CTE), Above Tg | 190.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 80.0 ppm/°C |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 6.0 |
| Viskoossus | 6500.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI546
LOCTITE ABLESTIK QMI546, BMI, Die attach