LOCTITE® ABLESTIK QMI546

Features and Benefits

LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
  • Non-conductive
  • Stable at high temperatures
  • Hydrophobic
  • Void-free bondline
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE), Above Tg 190.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 80.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 10.0 °C
Thermal conductivity 0.2 W/mK
Thixotropic index 6.0
Viscosity 6500.0 mPa·s (cP)