BERGQUIST® GAP PAD® TGP HC3000
Poznano kot Gap Pad® HC 3.0
Lastnosti in prednosti
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
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Tehnične informacije
| Barva | Modra |
| Delovna temperatura | -60.0 - 200.0 °C |
| Ocena plamena | V-0 |
| Standardna debelina | 0.508 - 3.175 mm |
| Toplotna prevodnost | 3.0 W/mK |
| Vrsta nosilca | Steklena vlakna |
| Youngovi moduli, ASTM D575 | 110.0 KPa (16.0 psi ) |
BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.