BERGQUIST® GAP PAD® TGP HC3000
Známé jako Gap Pad® HC 3.0
Vlastnosti a výhody
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
Oblasti Použití
Dokumenty ke stažení
Hledáte TS nebo BL v jiném jazyce?
Další dokumenty
Technické informace
| Barva | Modrá |
| Hodnocení hořlavosti | V-0 |
| Provozní teplota | -60.0 - 200.0 °C |
| Standardní tloušťka | 0.508 - 3.175 mm |
| Tepelná vodivost | 3.0 W/mK |
| Typ přepravce | Skleněná vlákna |
| Youngův modul, ASTM D575 | 110.0 KPa (16.0 psi ) |
BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.