BERGQUIST® GAP PAD® TGP HC3000
Known as Gap Pad® HC 3.0
Features and Benefits
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
- Thermal conductivity: 3.0 W/m-K
- High compliance, low compression stress
- Fiberglass-reinforced for shear and tear resistance
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Blue |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 3.0 W/mK |
| Young's modulus, ASTM D575 | 110.0 KPa (16.0 psi ) |
BERGQUIST® GAP PAD® TGP HC3000
This thermally conductive, silicone-based, fiberglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.