LOCTITE® ABLESTIK QMI536NB
Omadused ja eelised
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Tehniline teave
| Ekstraheeritav ioonisisu, Fluoriid (F-) | 19.0 ppm |
| Ekstraheeritav ioonisisu, Kaalium (K+) | 19.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 19.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 19.0 ppm |
| Klaasistumistemperatuur (Tg) | -30.0 °C |
| Kuumlõike nihkejõud | 15.0 kg-f |
| Rakendused | Stantskinnitus |
| Soojuspaisumise koefitsient (CTE) | 80.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 150.0 ppm/°C |
| Soovitatav kasutada koos | Laminaat, Polüimiid |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 5.0 |
| Viskoossus | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.