LOCTITE® ABLESTIK QMI536NB
Elementi i pogodnosti
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Dokumenti i preuzimanja
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Tehnički podaci
| Jonski sadržaj koji se izvlači, Fluorid (F-) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Kalijum (K+) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Natrijum (Na+) | 19.0 ppm |
| Koeficijent toplotnog širenja (CTE) | 80.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Above Tg | 150.0 ppm/°C |
| Preporučuje se za upotrebu sa | Laminat, Poliimid |
| Primene | Dodavanje boje |
| Sila smicanja vrućeg kalupa | 15.0 kg-f |
| Temperatura razmekšavanja (Tg) | -30.0 °C |
| Tiksotropni indeks | 5.0 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536NB
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.