LOCTITE® ABLESTIK ABP 8068TB
Características e Benefícios
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.
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Informação Técnica
| Coeficiente de expansão térmica (CTE) | 25.0 ppm/°C |
| Tipo de cura | Cura por Calor |
| Viscosidade, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
| Índice tixotrópico | 5.5 |
LOCTITE® ABLESTIK ABP 8068TB
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.