LOCTITE® ABLESTIK ABP 8068TB
Vlastnosti a výhody
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.
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Technické informace
| Koeficient tepelné roztažnosti (CTE) | 25.0 ppm/°C |
| Tixotropní index | 5.5 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK ABP 8068TB
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.