BERGQUIST® HI FLOW THF 5000UT
Features and Benefits
A breakthrough, unreinforced, thermally-conductive phase-change material designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.
BERGQUIST® HI FLOW THF 5000UT is a multi award-winning reworkable phase change thermal interface material designed for use between a heat sink and a variety of heat generating components. The material flows at its phase change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.
- Designed for thin, 25 µm (minimum) bond line with low thermal impedance (0.04° C-cm2/W at 35psi, 0.06° C-cm2/W at <10psi)
- Solid at room temperature, flows and fills the interface at target temperature 45°C (113° F)
- Thermal conductivity up to 8.5 W/m-K
Documents and Downloads
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Additional Documents
Technical Information
| Key characteristics | Conductivity: thermally conductive, Reworkable |
BERGQUIST® HI FLOW THF 5000UT
A breakthrough, unreinforced, thermally-conductive phase-change material designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.