BERGQUIST® HI FLOW THF 5000UT
Features and Benefits
This breakthrough, unreinforced, thermally conductive phase-change material is designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimising stress.
BERGQUIST® HI FLOW THF 5000UT is a multi-award-winning reworkable phase-change thermal interface material designed for use between a heat sink and a variety of heat-generating components. The material flows at its phase-change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.
- Designed for thin, 25 µm (minimum) bond lines with low thermal impedance (0.04°C / 32°F -cm2/W at 35 psi, 0.06°C / 32.1°F -cm2/W at < 10 psi)
- Solid at room temperature, it flows and fills the interface at target temperature 45°C (113° F)
- Thermal conductivity: 8.5 W/m-K
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Technical Information
| Key characteristics | Conductivity: thermally conductive, Reworkable |
BERGQUIST® HI FLOW THF 5000UT
This breakthrough, unreinforced, thermally conductive phase-change material is designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimising stress.