LOCTITE® ABLESTIK 84-3J

功能與優點

LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
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技術資訊

RT 模剪切強度 21.0 kg-f
可萃取出的離子含量, 氯化物(CI-) 10.0 ppm
可萃取出的離子含量, 鈉(Na+) 5.0 ppm
可萃取出的離子含量, 鉀(K+) 20.0 ppm
固化類型 熱固化
導熱性 0.5 W/mK
應用 晶片焊接
拉伸模量, @ 250.0 °C 172.0 N/mm² (25000.0 psi )
熱膨脹係數 (CTE) 41.0 ppm/°C
熱膨脹係數 (CTE), Above Tg 112.0 ppm/°C
玻璃化溫度(Tg) 87.0 °C
粘度,Brookfield CP51, @ 25.0 °C Speed 5 rpm 20000.0 mPa.s (cP)
觸變指數 2.5