LOCTITE® ABLESTIK 84-3J
特長および利点
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
詳細はこちら
技術情報
RTダイせん断強度 | 21.0 kg-f |
アプリケーション(用途) | ダイ接着剤 |
ガラス転移温度 (Tg) | 87.0 °C |
チクソ性指数 | 2.5 |
引張係数, @ 250.0 °C | 172.0 N/mm² (25000.0 psi ) |
抽出可能なイオン含有量, カリウム(K+) | 20.0 ppm |
抽出可能なイオン含有量, ナトリウム(Na+) | 5.0 ppm |
抽出可能なイオン含有量, 塩化物 (CI-) | 10.0 ppm |
熱伝導率 | 0.5 W/mK |
熱膨張率 | 41.0 ppm/°C |
熱膨張率, Above Tg | 112.0 ppm/°C |
硬化タイプ | 熱硬化 |
粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 20000.0 mPa.s (cP) |