LOCTITE® ABLESTIK NCA 2380
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This epoxy, electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature-sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
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Información técnica
| Coeficiente de dilatación térmica (CDT) | 56.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 183.0 ppm/°C |
| Módulo de almacenaje | 3.0 GPa |
| Temperatura de transición vítrea (Tg) | 95.0 °C |
| Tipo de curado | Curado térmico y por UV |
| Viscosidad, Shear Rate 10 s⁻¹ | 35000.0 mPa.s (cP) |
| Índice tixotrópico | 2.4 |
LOCTITE® ABLESTIK NCA 2380
This epoxy, electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.