LOCTITE® ABLESTIK NCA 2380
Features and Benefits
This epoxy, electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature-sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
- UV curable
- Good flow performance
- Excellent adhesion
- High Tg
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Coefficient of thermal expansion (CTE) | 56.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 183.0 ppm/°C |
| Cure type | Heat + UV cure |
| Glass transition temperature (Tg) | 95.0 °C |
| Storage modulus | 3.0 GPa |
| Thixotropic index | 2.4 |
| Viscosity, Shear Rate 10 s⁻¹ | 35000.0 mPa·s (cP) |
LOCTITE® ABLESTIK NCA 2380
This epoxy, electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.