BERGQUIST® GAP PAD® TGP 1500
Zināms kā Gap Pad® 1500
Iezīmes un ieguvumi
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Tehniskā informācija
| Darbības temperatūra | -60.0 - 200.0 °C |
| Junga modulis, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Krāsa | Melna |
| Siltumvadītspēja | 1.5 W/mK |
| Standarta biezums | 0.508 - 5.08 mm |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.