BERGQUIST® GAP PAD® TGP 1500
Tuntud kui Gap Pad® 1500
Omadused ja eelised
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Tehniline teave
| Soojusjuhtivus | 1.5 W/mK |
| Standardpaksus | 0.508 - 5.08 mm |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Must |
| Youngi moodul, ASTM D575 | 310.0 KPa (45.0 psi ) |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.