LOCTITE® ABLESTIK ABP 8910T
Known as ABLESTIK ABP-8910T
Features and Benefits
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This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
LOCTITE® ABLESTIK ABP 8910T is a heat cure, electrically non-conductive adhesive ideal for use on medium to large die sizes, and perfect for copper, silver, PPF and alloy 42 substrates. It has high MRT performance, high thermal conductivity, and high reliability.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 28.0 ppm/°C |
| Cure type | Heat cure |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.