LOCTITE® ABLESTIK ABP 8910T
Známé jako ABLESTIK ABP-8910T
Vlastnosti a výhody
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.
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Technické informace
| Aplikace | Připevnění formy |
| Koeficient tepelné roztažnosti (CTE) | 28.0 ppm/°C |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.