LOCTITE® ABLESTIK 8200T
Features and Benefits
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200T electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
- Excellent adhesion to Ag plated LF
- Oven Curable
- Snap curable
- Low bleed
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 61.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 29.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 7.0 kg-f |
| RT die shear strength | 10.0 kg-f |
| Tensile modulus, @ 250.0 °C | 2921.0 N/mm² (423655.0 psi ) |
LOCTITE® ABLESTIK 8200T
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive