LOCTITE® ABLESTIK 8200T
Features and Benefits
This silver-filled, electrically conductive die-attach adhesive paste is designed for high-reliability package applications.
LOCTITE® ABLESTIK 8200T is a silver, electrically conductive die-attach adhesive for high-reliability package applications that require medium thermal and electrical conductivity. It's particularly ideal for PPF and silver substrates and exhibits improved JEDEC performance on QFN-type packages. LOCTITE ABLESTIK 6202C-X is designed with a proprietary hybrid chemistry technology and cures snappy when exposed to heat (it’s oven-curable).
- Snap curable
- Offers low bleed
- Improved JEDEC performance
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 61.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 29.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 7.0 kg-f |
| RT die shear strength | 10.0 kg-f |
| Tensile modulus, @ 250.0 °C | 2921.0 N/mm² (423655.0 psi ) |
LOCTITE® ABLESTIK 8200T
This silver-filled, electrically conductive die-attach adhesive paste is designed for high-reliability package applications.