LOCTITE® ABLESTIK 8200T
Caractéristiques et avantages
This silver-filled, electrically conductive die-attach adhesive paste is designed for high-reliability package applications.
LOCTITE® ABLESTIK 8200T is a silver, electrically conductive die-attach adhesive for high-reliability package applications that require medium thermal and electrical conductivity. It's particularly ideal for PPF and silver substrates and exhibits improved JEDEC performance on QFN-type packages. LOCTITE ABLESTIK 6202C-X is designed with a proprietary hybrid chemistry technology and cures snappy when exposed to heat (it’s oven-curable).
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 61.0 ppm/°C |
| Module d'élasticité, @ 250.0 °C | 2921.0 N/mm² (423655.0 psi ) |
| Résistance au cisaillement puce RT | 10.0 kg-f |
| Résistance au cisaillement puce chaude | 7.0 kg-f |
| Teneur ionique extractible, Chlorure (Cl) | 9.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 29.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 9.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
LOCTITE® ABLESTIK 8200T
This silver-filled, electrically conductive die-attach adhesive paste is designed for high-reliability package applications.