BERGQUIST® GAP PAD TGP 12000ULM
Features and Benefits
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 12000ULM is an extremely soft, ultra low modulus (ULM) resin material with a unique filler package, which provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface while protective liners on both sides allow for easy application.
- Thermal conductivity: 12 W/m-K (ASTM D5470)
- Exceptional thermal performance at low pressures
- Ultra-low modulus allows for excellent adhesion to rough surfaces
- Supplied with protective liners for ease of use
- High-compliance
Documents and Downloads
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Additional Documents
Technical Information
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 12.0 W/mK |
BERGQUIST® GAP PAD TGP 12000ULM
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).