BERGQUIST® GAP PAD® TGP 2400
Features and Benefits
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.
BERGQUIST® GAP PAD® TGP 2400 is a pre-cured, silicone-based, thermally conductive reinforced gap pad. It is highly conformable, exhibits thermal resistance and softness, and is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
- Thermal conductivity: 2.4 W/m-K (ASTM D5470)
- Low thermal resistance at very low pressures
- Highly conformable
- Designed for low-stress applications
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Color | Light yellow |
| Density | 3.1 g/cm³ |
| Dielectric breakdown voltage | 3000.0 Vac |
| Dielectric constant, @ 1kHz | 6.6 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.0 J/g-K |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 20.0 |
| Standard thickness | 0.254 - 6.35 mm |
| Thermal conductivity | 2.4 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2400
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.