Patient diagnostics and sensing in real time require new electronic devices that are worn in and outside of a controlled medical environment. Wearables for monitoring vital signs such as respiratory, cardiovascular and glucose levels are becoming more important in patient’s everyday life. This trend of wearable, non-invasive and active patient monitoring continues.
Various methods can have limitations
Before explaining how low pressure molding works, let’s review other methods for encapsulation and protection. Traditional materials used for encapsulation and protection include potting and conformal coating. There are limitations with these methods which include:
Potting – this process includes two-part systems so there is mixing required and the solution is non-reworkable. Potting includes a large equipment investment and footprint. This method faces limitations of the housing dimensions and space constraints. The cure schedule can be from 24 to 72 hours with up to 8 process steps which can impact production efficiencies. Potting typically includes 5-7 bill of materials (BOM) part numbers in inventory to manage.
Conformal Coating – material is a thin polymeric film which conforms to the electronic component or connectors and can be applied in various ways including brushing, spraying, dispensing and dip coating. The cure schedule of 4 to 12 hours, is typically less than potting and sealing but provides very limited mechanical strength. There can be up to 8 process steps with this method and 3-4 BOM part numbers in inventory.
The benefits of low pressure molding
Choosing a reliable partner
In addition to the advantages of low pressure molding as outlined, there are benefits to partnering with a supplier with material experience that can provide application engineering support for input on product design and mold design for process optimization and product reliability and safety. Contact us if you would like more information on low pressure molding.
Contact Us
Please fill out the form below and we'll respond shortly.