Wirebond Semiconductor Packaging
Advanced materials for wirebond packaging
For packaging specialists and device designers, the flexibility, cost and existing infrastructure of wirebonding remain among the technology's primary advantages and fuel its stronghold status. Increased semiconductor use in the automotive sector, among others, will help wirebond IC packaging continue on its growth trajectory, even as other packaging technologies such as flip-chip satisfy small form factor requirements.
Henkel has developed a comprehensive portfolio of advanced materials for various wirebond requirements – from smaller die to pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. A wide range of die attach pastes and films, encapsulants, solder pastes, package-level EMI shielding materials, and alternative wafer backside coating (WBC) die attach solutions deliver the process adaptability, cost-effectiveness and in-field reliability necessary for today’s advanced wirebond ICs.
