BERGQUIST® GAP PAD® TGP 6000ULM
Характеристики и ползи
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
Описание
Документи и файлове за изтегляне
Търсите ИЛТД или ИЛБ на друг език?
Допълнителни документи
Техническа информация
| Работна температура | -60.0 - 200.0 °C |
| Стандартна дебелина | 1.524 - 3.175 mm |
| Тип носеща основа | Стъклопласт |
| Цвят | Сиво |
BERGQUIST® GAP PAD® TGP 6000ULM
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).