Request a sample of our BERGQUIST GAP PAD TGP 6000ULM

Try our BERGQUIST GAP PAD TGP 6000ULM for yourself to see if it meets your business needs.

Request a Sample

BERGQUIST® GAP PAD TGP 6000ULM

Features and Benefits

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
  • Thermal conductivity: 6 W/m-K (ASTM D5470)
  • Excellent interfacing and wet-out characteristics
  • Supplied with protective liners for ease of use
  • UL94 V-0 compliant
Read More

Technical Information

Carrier type Fiberglass
Color Gray
Operating temperature -60.0 - 200.0 °C
Standard thickness 1.524 - 3.175 mm

Frequently Asked Questions

Request a Sample

There are some errors, please correct them below
This field is required
This field is required
This field is required
This field is invalid
This field is required
This field is required
This field is required
This field is required
Industry
Market Segment
Technology
Technology
Technology
Technology
Technology
Technology
Technology
Technology
Market Segment
Market Segment
Market Segment
Market Segment
Market Segment
Market Segment
Market Segment
Market Segment
This field is required

Keep in touch with us.

Please agree to receive information of offers and products from Henkel
You must agree with the terms and conditions

I can withdraw my consent at any time with effect for the future. Withdrawal of consent will not affect the lawfulness of data processing carried out before the withdrawal. Further information about the data processing can be found in the Privacy Policy below.