BERGQUIST® GAP FILLER TGF 1400SL
Features and Benefits
Self-leveling, thermally conductive, silicone-based liquid gap filler for heat transfer and vibration dampening. Excellent low and high temperature stability.
BERGQUIST® GAP FILLER TGF 1400SL is a 2-part, silicone based, thermally-conductive liquid gap filler. Its low viscosity enables self-leveling and filling of unique and intricate gaps, resulting in excellent thermal transfer and vibration dampening. It can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It’s curable at room temperature, but you can speed up the cure by applying heat.
- Self leveling, Injectable
- Excellent low and high temperature stability
- Excellent wet-out for low stress interface applications
- Thermal conductivity: 1.4 W/m-K
- Vibration dampening
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 1.4 W/mK |
| Mixed | |
| Color, Mixed | Yellow |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, thermally conductive, silicone-based liquid gap filler for heat transfer and vibration dampening. Excellent low and high temperature stability.