LOCTITE® 3621
被稱為 Chipbonder 3621
功能與優點
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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技術資訊
| 儲存溫度 | 2.0 - 8.0 °C |
| 剪切強度, 鋼（噴砂） | 2175.0 psi |
| 卡森粘度，錐型和板型，Haake PK100、M10/PK1，2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| 固化類型 | 熱固化 |
| 屈服點、錐板、Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| 建議固化方式, @ 150.0 °C | 90.0 - 120.0 秒 |
| 熱膨脹係數 (CTE), Above Tg | 100.0 ppm/°C |
| 物理形態 | 凝膠 |
| 零組件數 | 1 組分 |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.