LOCTITE® ABLESTIK SSP 2020
被稱為 LOCTITE ABLESTIK SSP 2020 18G
功能與優點
LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach
LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.
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技術資訊
可萃取出的離子含量, 氯化物(CI-) | 0.9 ppm |
可萃取出的離子含量, 鈉(Na+) | 0.9 ppm |
可萃取出的離子含量, 鉀(K+) | 0.9 ppm |
固化類型 | 熱固化 |
應用 | 晶片焊接 |
拉伸模量, @ 250.0 °C | 5615.0 N/mm² (800000.0 psi ) |