LOCTITE® ABLESTIK QMI529HT
功能與優點
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
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技術資訊
| RT 模剪切強度, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| 可萃取出的離子含量, 氟化物(F-) | 20.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 20.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 20.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 20.0 ppm |
| 固化類型 | 熱固化 |
| 建議推廣應用 | 導線架：金, 導線架：銀 |
| 應用 | 晶片焊接 |
| 拉伸模量, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
| 熱模剪切強度, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| 熱膨脹係數 (CTE) | 53.0 ppm/°C |
| 物理形態 | 黏貼 |
| 觸變指數 | 4.8 |
| 關鍵特性 | 導電性：導熱, 導電性：導電 |
| 零組件數 | 1 組分 |
LOCTITE® ABLESTIK QMI529HT
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.