LOCTITE® ABLESTIK 2035SC
功能與優點
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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技術資訊
| RT 模剪切強度 | 25.0 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 29.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 89.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 19.0 ppm |
| 固化類型 | 熱固化 |
| 導熱性 | 0.35 W/mK |
| 建議固化方式, 推薦的： @ 110.0 °C | 90.0 秒 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMTA @ 25.0 °C | 68.0 N/mm² (10000.0 psi ) |
| 熱模剪切強度 | 7.0 kg-f |
| 熱膨脹係數 (CTE) | 54.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 128.0 ppm/°C |
| 玻璃化溫度(Tg) | 120.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
| 觸變指數 | 4.2 |
| 關鍵特性 | 導電性：不導電 |
LOCTITE® ABLESTIK 2035SC
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.