LOCTITE® ABLESTIK QMI519LB
Poznano kot QMI519LB (20G)
Lastnosti in prednosti
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Tehnične informacije
| Izvlečna ionska vsebina, Kalij (K+) | 19.0 ppm |
| Izvlečna ionska vsebina, Klorid (CI-) | 19.0 ppm |
| Izvlečna ionska vsebina, Natrij (Na+) | 19.0 ppm |
| Koeficient toplotnega raztezanja (CTE) | 40.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Primeri uporabe | Pritrjevalniki |
| Strižna trdnost RT, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive