BERGQUIST® GAP FILLER TGF 1000
Poznat kao Gap Filler 1000
Elementi i pogodnosti
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Tehnički podaci
| Dielektrična konstanta, @ 1kHz | 5.0 |
| Gustina | 1.6 g/cm³ |
| Odnos mešanja po težini | 1 : 1 |
| Odnos mešanja po zapremini | 1 : 1 |
| Otpornost na plamen | V-0 |
| Raspored polimerizacije, @ 100.0 °C | 5.0 minuta |
| Raspored polimerizacije, @ 25.0 °C | 60.0 - 120.0 minuta |
| Temperatura čuvanja | 25.0 °C |
| Toplotna provodljivost | 1.0 W/mK |
| Toplotni kapacitet, ASTM E1269 | 1.0 J/g-K |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Shore 00 | 30.0 |
| Vek trajanja | 6.0 mesec |
| Vek trajanja nakon otvaranja, @ 25.0 °C | 15.0 minuta |
| Zapreminska otpornost | 1×10 Ohm m |
| Učvršćivač | |
| Boja, Učvršćivač | Bela |
| Smola | |
| Boja, Smola | Siva |
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.