Optical Transceivers

Material Solutions for High Performance Optical Trasnceiver Applications

Increased demand for streaming services, data storage, analytics and cloud-based applications are driving the requirement for next-generation high-speed network access and data processing capabilities across cities, countries and continents. To manage these accelerating data rates and volumes, the industry is transitioning to the 400 Gigabit Ethernet (GbE) standard -- which incorporates a range of modules including 400ZR -- for faster switching and routing. Optical transceivers are the backbone of data movement; meeting the needs of all types of 400 GbE module assembly and reliability is critical and why more companies are choosing Henkel when it comes TOSA/ROSA assembly materials. 

Transceiver Applications

Laser Diode Bonding

Laser diodes are the most common type of lasers produced and have a wide range of uses including fiber optic communication applications. Henkel’s die-attach portfolio, including high thermal semi-sintering materials, enables the reliable connection of these devices. 

Optical Sub-Assembly (OSA)

A precise active optical alignment process enables accurate, cost-effective production of optical sub-assemblies such as TOSA, ROSA, BOSA. Henkel’s dual-cure UV adhesives are designed to precisely align optical components and secure their long-term performance through stability-enhancing attributes such as low shrinkage, low CTE, good light transmittance, low moisture absorption and high reliability.

Structural Bonding

LOCTITE® structural adhesives are used throughout optoelectronics devices to facilitate lens bonding and sealing, PCB to lid bonding, and front cover and housing bonding, among other applications. Available in a range of different chemistries to accommodate process preferences, LOCTITE® adhesives are compatible with multiple surfaces including metals, glass and plastics.

Thermal Management

As power densities increase alongside higher bandwidth performance, transceivers and other optical modules require high performance thermal control to remove heat for optimum performance. Available in liquid, gel and pad mediums, award-winning BERGQUIST thermal interface materials allow for broad design and assembly flexibility while also providing effective heat management within optical modules.

News & Insights

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