BERGQUIST® GAP FILLER TGF 2200 APS

BERGQUIST® GAP FILLER TGF 2200 APS is a 2-part, thermally conductive, silicone-based liquid gap filler, which offers infinite thickness variations with little or no stress to the sensitive components during or following assembly. Designed for applications requiring low density for light weighting, and high thermal conductivity to provide optimum thermal performance, its optimised shear thinning characteristics make it easy to dispense, and you can expect excellent low- and high-temperature mechanical and chemical stability. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps. Perfect for use in automotive power storage (APS) applications.