LOCTITE® ABLESTIK 2035SC
Features and Benefits
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 54.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 128.0 ppm/°C |
| Cure schedule, Recommended @ 110.0 °C | 90.0 sec. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 89.0 ppm |
| Glass transition temperature (Tg) | 120.0 °C |
| Hot die shear strength | 7.0 kg-f |
| Key characteristics | Conductivity: electrically non-conductive |
| RT die shear strength | 25.0 kg-f |
| Tensile modulus, DMTA @ 25.0 °C | 68.0 N/mm² (10000.0 psi ) |
| Thermal conductivity | 0.35 W/mK |
| Thixotropic index | 4.2 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2035SC
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.