BERGQUIST® HI FLOW THF 1600P

Known as Hi-Flow® 300P

Features and Benefits

This high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement is designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.
BERGQUIST® HI FLOW THF 1600P is an electrically insulating, thermally conductive 55°C (131°F) phase reinforced change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.
  • Thermal impedance: 0.13°C (32°F) in2/W @ 25 psi
  • Outstanding thermal performance in an insulated pad
  • Excellent cut-through resistance
  • Excellent dielectric performance
  • Phase change softening temp 55°C (131°F)
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Technical Information

Carrier type Polyimide
Color Green
Flame rating V-0
Operating temperature 150.0 °C
Standard thickness 0.102 - 0.127 mm
Thermal conductivity 1.6 W/mK

Frequently Asked Questions